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The thermocouple temperature is limited also by other materials used. For example beryllium oxide, a popular material for high temperature applications, tends to gain conductivity with temperature; a particular configuration of sensor had the insulation resistance dropping from a megaohm at 1000 K to 200 ohms at 2200 K. At high temperatures ...
Absolute Seebeck coefficient of lead at low temperature, according to Christian, Jan, Pearson, Templeton (1958). Below the critical temperature of lead (indicated by the dashed line, approximately 7 K) the lead is superconducting. Absolute Seebeck coefficients of various metals up to high temperatures, mainly from Cusack & Kendall (1958).
The two top thermocouple junctions are at temperature T 1 while the two bottom thermocouple junctions are at temperature T 2. The output voltage from the thermopile, ΔV , is directly proportional to the temperature differential, ΔT or T 1 - T 2 , across the thermal resistance layer and number of thermocouple junction pairs.
The efficiency of a thermoelectric device for electricity generation is given by , defined as =.. The maximum efficiency of a thermoelectric device is typically described in terms of its device figure of merit where the maximum device efficiency is approximately given by [7] = + ¯ + ¯ +, where is the fixed temperature at the hot junction, is the fixed temperature at the surface being cooled ...
Vertical design has thermocouples arranged vertically between the hot and cool plates, leading to high integration of thermocouples as well as a high output voltage, making this design the most widely-used design commercially. The mixed design has the thermocouples arranged laterally on the substrate while the heat flow is vertical between plates.
Finally, the placement of several thermocouples should range from populated to less populated areas of the PCB for the best sampling conditions. [9]: 20 Several methods of attachment are used, including epoxy, high-temperature solder, Kapton and aluminum tape, each with various levels of success for each method. [10]
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