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Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [ 1 ]
Simplified diagram for electroplating copper (orange) on a conductive object (the cathode, "Me", gray). The electrolyte is a solution of copper sulfate, CuSO 4 in sulfuric acid. A copper anode is used to replenish the electrolyte with copper cations Cu 2+ as they are plated out at the cathode.
This plating is a combination of a high-nickel zinc-nickel alloy (10–15% nickel) and some variation of chromate. The most common mixed chromates include hexavalent iridescent, trivalent or black trivalent chromate. Used to protect steel, cast iron, brass, copper, and other materials, this acidic plating is an environmentally safe option. [6]
The processed surface is then coated with electroless copper or nickel before further plating. This process gives useful (about 1 to 6 kgf /cm or 10 to 60 N /cm or 5 to 35 lbf /in) adhesion force, but is much weaker than actual metal-to-metal adhesion strength.
Copper plating may refer to: Copper electroplating , a technique of electroplating a layer of copper onto a metal object Electroless copper plating , an auto-catalytic chemical technique used to deposit a layer of copper on a solid workpiece
Copper foil is a thin sheet of copper metal that is widely used in various applications due to its excellent electrical conductivity, malleability, and corrosion resistance. It is an essential material in the electronics industry, especially for manufacturing printed circuit boards (PCBs) and other electronic components.
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Schematic apparatus for electrotyping. An electric current flows from the battery, through the copper anode, the electrolyte, and the coated mold. A copper film (the electrotype) grows onto the electrically conducting coating of the mold. Electrotyping (also galvanoplasty) is a chemical method for forming metal parts that exactly reproduce a model.