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In older Intel/AMD architectures the southbridge is usually linked to the northbridge, which in turn connected to the CPU. Circa 2004 and onward Intel architectures started to link southbridge directly to the CPU (e.g. via Direct Media Interface). Through the use of controller-integrated channel circuitry, the northbridge (or CPU itself) can ...
According to AMD, Bulldozer-based CPUs are based on GlobalFoundries' 32 nm Silicon on insulator (SOI) process technology and reuses the approach of DEC for multitasking computer performance with the arguments that it, according to press notes, "balances dedicated and shared computer resources to provide a highly compact, high units count design that is easily replicated on a chip for ...
The rear panel aperture is identical to the EEB and ATX specification and expansion cards mounted on an SSI CEB motherboard appear much the same as they would on an ATX motherboard. To standardize thermal behavior, processor position is defined, including primary and secondary processor identification.
Multi-core, L4 cache on certain low and ultra low power models (Kaby Lake-U and Kaby Lake-Y), Intel Sunny Cove 2019 14–20 Multicore, 2-way multithreading, massive OoOE engine, 5 wide superscalar/5 issue. Intel Cypress Cove 2021 14 multicore, 5 wide superscalar/6 issues, massive OoOE engine, big core design. Intel Willow Cove 2020 Multicore, SMT
To keep costs low on high-volume competitive products, the CPU core is usually bundled into a system-on-chip (SOC) integrated circuit. SOCs contain the processor core, cache and the processor's local data on-chip, along with clocking, timers, memory (SDRAM), peripheral (network, serial I/O), and bus (PCI, PCI-X, ROM/Flash bus, I2C) controllers.
The Bobcat x86 CPU core design has since been completed and implemented in AMD APU processor products with a TDP of 18 W or less. The core is targeted at low-power markets like netbooks/nettops, ultra-portable laptops, consumer electronics and the embedded market. Since its launch, Bobcat-based CPUs have also been used by OEMs on larger laptops.
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