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Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes.
Mixtures may have variable thermal conductivities due to composition. Note that for gases in usual conditions, heat transfer by advection (caused by convection or turbulence for instance) is the dominant mechanism compared to conduction. This table shows thermal conductivity in SI units of watts per metre-kelvin (W·m −1 ·K −1).
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
A temperature drop is observed at the interface between the two surfaces in contact. This phenomenon is said to be a result of a thermal contact resistance existing between the contacting surfaces. Thermal contact resistance is defined as the ratio between this temperature drop and the average heat flow across the interface. [1]
Thermal conduction is the diffusion of thermal energy (heat) within one material or between materials in contact. The higher temperature object has molecules with more kinetic energy ; collisions between molecules distributes this kinetic energy until an object has the same kinetic energy throughout.
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