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Pergolide, sold under the brand name Permax and Prascend (veterinary) among others, is an ergoline-based dopamine receptor agonist used in some countries for the treatment of Parkinson's disease. Parkinson's disease is associated with reduced dopamine synthesis in the substantia nigra of the brain .
(1) Gold wire (2) Purple plague (3) Copper substrate (4) Gap eroded by wire-bond (5) Aluminium contact Gold–aluminium phase diagram. Gold–aluminium intermetallic is a type of intermetallic compound of gold and aluminium that usually forms at contacts between the two metals. Gold–aluminium intermetallic have different properties from the ...
Aluminium (British and IUPAC spellings) or aluminum (North American spelling) combines characteristics of pre- and post-transition metals. Since it has few available electrons for metallic bonding, like its heavier group 13 congeners, it has the characteristic physical properties of a post-transition metal, with longer-than-expected interatomic ...
All-aluminum systems in semiconductor fabrication eliminate the "purple plague"—a brittle gold-aluminum intermetallic compound—sometimes associated with pure gold bonding wire. This property makes aluminum ideal for ultrasonic bonding.) Diagram of a finished ball bond wire connection. Next the wire is passed out through the capillary and ...
The use of larger gauge stranded aluminum wire (larger than #8 AWG) is fairly common in much of North America for modern residential construction. Aluminum wire is used in residential applications for lower voltage service feeders from the utility to the building. This is installed with materials and methods as specified by the local electrical ...
Its disadvantages include the cost of refrigeration of the wires to superconducting temperatures (often requiring cryogens such as liquid nitrogen or liquid helium), the danger of the wire quenching (a sudden loss of superconductivity), the inferior mechanical properties of some superconductors, and the cost of wire materials and construction. [2]
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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
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