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The test often reveals problems that occurred during assembly, such as defective components, improper component placement, and insulator defects that may cause inadvertent shorting or grounding to chassis, in turn, compromising electrical circuit quality and product safety. [2]
An insulation resistance test (IR test) measures the electrical resistance of insulation by applying a voltage between two locations, and measuring the resultant current flow. Proper safety precautions must be taken when doing this test, such as exclusion zones, making sure no wires are exposed, and personal protective equipment is worn.
A chassis ground is a link between different metallic parts of a machine to ensure an electrical connection between them. [1] Examples include electronic instruments and motor vehicles. Usages
The role “ground” may be ambiguous in systems that isolate different kinds of grounds (typical isolated grounds are analog signal ground, digital signal ground, AC power ground, DC power ground, and chassis ground). If different kinds of ground paths are in separate paths in a connector, the analysis should treat them as separate signals.
The publication describes requirements, levels and test methods to achieve immunity compliance of an electronic product. The purpose is to create a reproducible ground for product compliance and the standard defines: ranges, levels, test equipment, setups, procedures, calibrations, generator waveforms and general uncertainties.
The holidays are a festive time of year. Homes are decorated for the season — Christmas trees, ornaments, poinsettias, and the like. And there are also plenty of holiday treats that are ...
Electrical equipment may be designed with a floating ground for one of several reasons. One is safety. For example, a low-voltage DC power supply, such as a mobile phone charger, is connected to the mains through a transformer of one type or another, and there is no direct electrical connection between the current return path on the low-voltage side and physical ground (earth).
In semiconductor testing, the device under test is a die on a wafer or the resulting packaged part. A connection system is used, connecting the part to automatic or manual test equipment. The test equipment then applies power to the part, supplies stimulus signals, then measures and evaluates the resulting outputs from the device.