Search results
Results from the WOW.Com Content Network
It is used to deposit copper and other conductors in forming printed circuit boards and copper interconnects in integrated circuits. It is also used to purify metals such as copper. The aforementioned electroplating of metals uses an electroreduction process (that is, a negative or cathodic current is on the working
Excluding the continuous strip plating industry, copper is the second most commonly-plated metal after nickel. [6] Copper electroplating offers a number of advantages over other plating processes, including low metal cost, high-conductivity and high-ductility bright finish, and high plating efficiency.
Electroplating of zinc was invented in 1800 but the first bright deposits were not obtained until the early 1930s with the alkaline cyanide electrolyte. Much later, in 1966, the use of acid chloride baths improved the brightness even further. The latest modern development occurred in the 1980s, with the new generation of alkaline, cyanide-free ...
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [19]
It is also possible to form coatings of newer materials (e.g., met glass. beta-C 3 N 4), graded deposits, multi-component deposits etc. The advanced materials and deposition processes including recent developments in ultra hard materials like BAM (AlMgB compound)are fully covered in a recent book[R. Chattopadhyay:Green Tribology,Green Surface ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The seed metals are alloys and are deposited by sputtering onto the wafer with the chips to be bumped. A photoresist mask is used to only deposit the seed metal on top of the contact pads of the chips. The wafer then undergoes electroplating, and the photoresist layer is removed or stripped.
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.