Search results
Results from the WOW.Com Content Network
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged.
Chip-on-flex: Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead. TAB: Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs. COG: Chip-on-glass
Laser marking of plastic-encapsulated packages may damage the chip if glass spheres in the packaging line up and direct the laser to the chip. [3] Examples of semiconductor failures relating to semiconductor crystals include: Nucleation and growth of dislocations. This requires an existing defect in the crystal, as is done by radiation, and is ...
The air in chip bags is actually nitrogen, and it's there for a reason. "The reason for the nitrogen and chip ratio is to keep the chips safe during transportation," Aragon said. If the bags were ...
Chipseal (also chip seal or chip and seal or spray seal) is a pavement surface treatment that combines one or more layers of asphalt with one or more layers of fine aggregate. In the United States, chipseals are typically used on rural roads carrying lower traffic volumes, and the process is often referred to as asphaltic surface treatment .
For premium support please call: 800-290-4726 more ways to reach us
eFUSEs may be used to disconnect parts of chips such as cores, either because they did not work as intended during binning, or as part of market segmentation (using the same chip for low, mid and high-end tiers). Chips may have spare parts to allow the chip to fully pass testing even if it has several non-working parts.