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True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package: A WL-CSP or WLCSP package is just a bare die with a redistribution layer (or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package. [19 ...
WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography .
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .
die – an unpackaged integrated circuit; a rectangular piece cut (diced) from a processed wafer; die-to-die (also die-on-die) stacking – bonding and integrating individual bare dies atop one another; die-to-wafer (also die-on-wafer) stacking – bonding and integrating dies onto a wafer before dicing the wafer
Level 0 - "Chip", protecting a bare semiconductor die from contamination and damage. Level 1 - Component, such as semiconductor package design and the packaging of other discrete components. Level 2 - Etched wiring board (printed circuit board). Level 3 - Assembly, one or more wiring boards and associated components.
Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the BGA package substrate or flip chip substrate, also called a BGA or flip chip interposer, is dark yellow, and the silicon die appears dark blue Underside of a die from a flip chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip chip mounting are visible