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reengineered P6-based microarchitecture used in Intel Core 2 and Xeon microprocessors, built on a 65 nm process, supporting x86-64 level SSE instruction and macro-op fusion and enhanced micro-op fusion with a wider front end and decoder, larger out-of-order core and renamed register, support loop stream detector and large shadow register file.
Haswell-EP models with ten and more cores support cluster on die (COD) operation mode, [75] allowing CPU's multiple columns of cores and last level cache (LLC) slices to be logically divided into what is presented as two non-uniform memory access (NUMA) CPUs to the operating system. By keeping data and instructions local to the "partition" of ...
For a list of Intel CPUs which support FDI, see Westmere (microarchitecture), Sandy Bridge (microarchitecture), Ivy Bridge (microarchitecture), Haswell (microarchitecture). Most of them are also listed on Comparison of Intel graphics processing units, see sections on generations 5, 6, 7, 8.
Two Serial ATA (SATA) 3.0 controllers are integrated into the X99 chipset, providing a total of up to ten ports for storage devices and supporting speeds of up to 6 Gbit/s per port, with hardware support for the Advanced Host Controller Interface (AHCI) logical interface. Each SATA port may be enabled or disabled as needed.
On June 3, 2013, Intel started shipping Intel Core i7 and Intel Core i5 processors based on Intel's Haswell microarchitecture in 22 nm tri-gate FinFET technology for series 8 chipsets. [17] Intel's 22nm process has a transistor density of 16.5 million transistors per square milimeter (MTr/mm2). [18]
Intel Haswell: 2013 14–19 SoC design, multi-core, multithreading, 2-way simultaneous multithreading, hardware-based transactional memory (in selected models), L4 cache (in GT3 models), Turbo Boost, out-of-order execution, superscalar, up to 8 MB L3 cache (mainstream), up to 20 MB L3 cache (Extreme) Broadwell: 2014 14–19 Multi-core ...
Haswell and Broadwell feature a Fully Integrated Voltage Regulator. Broadwell (previously Rockwell) is the fifth generation of the Intel Core processor. It is Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. It is a "tick" in Intel's tick–tock principle as the next step in semiconductor fabrication.
Process–architecture–optimization is a development model for central processing units (CPUs) that Intel adopted in 2016. Under this three-phase (three-year) model, every microprocessor die shrink is followed by a microarchitecture change and then by one or more optimizations.