enow.com Web Search

Search results

  1. Results from the WOW.Com Content Network
  2. Advanced packaging (semiconductors) - Wikipedia

    en.wikipedia.org/wiki/Advanced_packaging...

    Advanced packaging thus sits between fabrication and traditional packaging -- or, in other terminology, between BEoL and post-fab. Advanced packaging includes multi-chip modules, 3D ICs, [2] 2.5D ICs, [2] heterogeneous integration, [3] fan-out wafer-level packaging, [2] system-in-package, quilt packaging, combining logic (processors) and memory ...

  3. Center for Advanced Materials, University of Houston - Wikipedia

    en.wikipedia.org/wiki/Center_for_Advanced...

    The Center for Advanced Materials, formerly the Space Vacuum Epitaxy Center, is a laboratory established in 1986 at the University of Houston for researching the science and application of advanced materials. It is hosted in 8,000 square feet (740 m 2) of space in three buildings on the Houston campus

  4. Houston Advanced Research Center - Wikipedia

    en.wikipedia.org/wiki/Houston_Advanced_Research...

    The Houston Area Research Center changed its name to what HARC is presently known to stand for – The Houston Advanced Research Center – in 1990. Construction of HARC's microwave imaging facility was completed the following year. New laboratories were opened for DNA technology and geographical information systems centering on the work of Tim ...

  5. US plans $75 million grant to Absolics for advanced chip ...

    www.aol.com/news/us-plans-75-million-grant...

    The US Commerce Department said on Thursday it plans to grant $75 million to Absolics for constructing a 120,000-square-foot facility in Georgia that will supply advanced materials to the country ...

  6. Microelectronics and Computer Technology Corporation

    en.wikipedia.org/wiki/Microelectronics_and...

    Advanced Microelectronics Packaging and Interconnection (smaller, faster, more powerful, and cost-competitive). Hardware Systems Engineering (tools and methodologies for cost-efficient, up-front design of advanced electronic systems, including modelling and design-for-test techniques to improve cost, yield, quality, and time-to-market).

  7. Fan-out wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Fan-out_wafer-level_packaging

    [1] [2] Fan-out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers, such as those seen in 2.5D and 3D packages. [3] [4] In conventional technologies, a wafer is diced first, and then individual dies are packaged; package size is usually considerably larger than the die size.

  8. Houston's plastic waste piles up, waiting on "advanced ... - AOL

    www.aol.com/houstons-plastic-waste-piles-waiting...

    Houston says it has collected 250 tons of plastic since the end of 2022, but almost none of it has been recycled yet. Houston's plastic waste piles up, waiting on "advanced recycling" Skip to main ...

  9. Eastman Chemical Company - Wikipedia

    en.wikipedia.org/wiki/Eastman_Chemical_Company

    It provides coatings, adhesives and specialty plastics products, is a major supplier of cellulose acetate fibers, and produces copolyesters for packaging. The company's products and operations are managed and reported in four operating segments: Additives & Functional Products, Advanced Materials, Chemical Intermediates, and Fibers. [3]