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  2. Laser cutting - Wikipedia

    en.wikipedia.org/wiki/Laser_cutting

    Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...

  3. List of laser types - Wikipedia

    en.wikipedia.org/wiki/List_of_laser_types

    Helium–silver (HeAg) metal-vapor laser [3] 224.3 nm Scientific research Strontium vapor laser: 430.5 nm Scientific research Neon–copper (NeCu) metal-vapor laser [3] 248.6 nm Electrical discharge in metal vapor mixed with neon buffer gas. Scientific research: Raman and fluorescence spectroscopy [4] [5] Copper vapor laser: 510.6 nm, 578.2 nm

  4. Laser engraving - Wikipedia

    en.wikipedia.org/wiki/Laser_engraving

    The same conduction that works against the spot vaporisation of metal is an asset if the objective is to vaporise some other coating away from the metal. Laser engraving metal plates are manufactured with a finely polished metal, coated with an enamel paint made to be "burned off". At levels of 10 to 30 watts, excellent engravings are made as ...

  5. Multiaxis machining - Wikipedia

    en.wikipedia.org/wiki/Multiaxis_machining

    Multiaxis machining is a manufacturing process that involves tools that move in 4 or more directions and are used to manufacture parts out of metal or other materials by milling away excess material, by water jet cutting or by laser cutting. This type of machining was originally performed mechanically on large complex machines.

  6. Laser pointer - Wikipedia

    en.wikipedia.org/wiki/Laser_pointer

    Red (635 nm), blueish violet (445 nm), and green (520 nm) laser pointers. A laser pointer or laser pen is a (typically battery-powered) handheld device that uses a laser diode to emit a narrow low-power visible laser beam (i.e. coherent light) to highlight something of interest with a small bright colored spot.

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    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  8. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

  9. Plasma cutting - Wikipedia

    en.wikipedia.org/wiki/Plasma_cutting

    Hand-held torches can usually cut up to 38 mm (1.5 in) thick steel plate, and stronger computer-controlled torches can cut steel up to 150 mm (6 in) thick. [citation needed] Since plasma cutters produce a very hot and very localized "cone" to cut with, they are extremely useful for cutting sheet metal in curved or angled shapes.

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