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  2. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  3. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .

  4. Anodic bonding - Wikipedia

    en.wikipedia.org/wiki/Anodic_bonding

    The bonding process starts; it is a combination of electrostatic and electrochemical processes. The electrical field intensity in the depletion region is so high that the oxygen ions drift to the bond interface and pass out to react with the silicon to form SiO 2 (compare to figure "ion drifting in bond glass" (2)). Based on the high field ...

  5. DCB - Wikipedia

    en.wikipedia.org/wiki/DCB

    Direct Copper Bonding, also Direct Bonding Copper, a type of power electronic substrate Direct Carrier Billing , a method of doing digital financial transactions Dithionite-Citrate-Bicarbonate method used for iron oxide removal from clays in soil science

  6. Surface activated bonding - Wikipedia

    en.wikipedia.org/wiki/Surface_activated_bonding

    Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High-strength bonding of semiconductors, metals, and dielectrics can be obtained even at room temperature ...

  7. Deion Sanders issues warning to NFL teams: Why they should ...

    www.aol.com/deion-sanders-issues-warning-nfl...

    Colorado head coach Deion Sanders issued a warning to NFL teams Friday − don’t draft Heisman Trophy winner Travis Hunter if you won’t let him play both ways.. Sanders said this on "The Rich ...

  8. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    2. Typically, thermocompression bonds are made with delivering heat and pressure to the mating surface by a hard faced bonding tool. Compliant bonding [11] is a unique method of forming this type of solid state bond between a gold lead and a gold surface since heat and pressure is transmitted through a compliant or deformable media. The use of ...

  9. Feels like 1979: Nottingham Forest moves into 2nd place ... - AOL

    www.aol.com/man-city-gets-much-needed-163112193.html

    Liverpool's Mohamed Salah, center, celebrates with teammates after scoring his side's third goal during the English Premier League soccer match between West Ham United and Liverpool at the London ...