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  2. Contact pad - Wikipedia

    en.wikipedia.org/wiki/Contact_pad

    Gold wire ball-bonded to a gold contact pad. Contact pads or bond pads are small, conductive surface areas of a printed circuit board (PCB) or die of an integrated circuit. They are often made of gold, copper, or aluminum and measure mere micrometres wide. Pads are positioned on the edges of die, to facilitate connections without shorting.

  3. Lead frame - Wikipedia

    en.wikipedia.org/wiki/Lead_frame

    Lead frame for a QFP package, before encapsulation DIP 16 pin Lead frame, after encapsulation and before cutting/separation. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad.

  4. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    The cross section shows a saw-singulated body with an attached thermal head pad. The lead frame is made of copper alloy and a thermally conductive adhesive is used for attaching the silicon die to the thermal pad. The silicon die is electrically connected to the lead frame by 1–2 thou diameter gold wires. The pads of a saw-singulated package ...

  5. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Die cutting or wafer dicing; IC packaging. Die attachment (The die is attached to a leadframe using conductive paste or die attach film. [136] [137]) IC bonding: Wire bonding, thermosonic bonding, flip chip or tape automated bonding (TAB) IC encapsulation or integrated heat spreader (IHS) installation

  6. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    In printed circuit board (PCB) design, a via consists of two pads in corresponding positions on different copper layers of the board, that are electrically connected by a hole through the board. [ citation needed ] The hole is made conductive by electroplating , or is lined with a tube or a rivet .

  7. Chip on board - Wikipedia

    en.wikipedia.org/wiki/Chip_on_board

    A finished semiconductor wafer is cut into dies.Each die is then physically bonded to the PCB. Three different methods are used to connect the terminal pads of the integrated circuit (or other semiconductor device) with the conductive traces of the printed circuit board.

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