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For several years, the Semiconductor Industry Association (SIA) gave this responsibility of coordination to the United States, which led to the creation of an American style roadmap, the National Technology Roadmap for Semiconductors (NTRS). [5] The first semiconductor roadmap, published by the SIA in 1993.
Gallium(III) oxide is an inorganic compound and ultra-wide-bandgap semiconductor with the formula Ga 2 O 3. It is actively studied for applications in power electronics, phosphors, and gas sensing. [5] [6] [7] The compound has several polymorphs, of which the monoclinic β-phase is the most stable.
The executive committee is drawn from regions with a major stake in developments in electronics: Europe, South Korea, Japan, Taiwan, and the United States. International Focus Teams (IFTs) assess present status and future evolution of the ecosystem in their specific field of expertise and produce a 15-year roadmap.
This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...
Indium gallium zinc oxide (IGZO) is a crystalline semiconducting material, consisting of indium (In), gallium (Ga), zinc (Zn) and oxygen (O), with a unique atomic arrangement that ensures stable performance. This unique crystalline structure enhances picture resolution and supports compatibility with diverse display technologies, contributing ...
Gallium arsenide was first synthesized and studied by Victor Goldschmidt in 1926 by passing arsenic vapors mixed with hydrogen over gallium(III) oxide at 600 °C. [7] [8] The semiconductor properties of GaAs and other III-V compounds were patented by Heinrich Welker at Siemens-Schuckert in 1951 [9] and described in a 1952 publication. [10]
The invention of the high-electron-mobility transistor (HEMT) is usually attributed to physicist Takashi Mimura (三村 高志), while working at Fujitsu in Japan. [4] The basis for the HEMT was the GaAs (gallium arsenide) MOSFET (metal–oxide–semiconductor field-effect transistor), which Mimura had been researching as an alternative to the standard silicon (Si) MOSFET since 1977.
International Technology Roadmap for Semiconductors; International Roadmap for Devices and Systems; Moore's law; MOSFET scaling; Nanostrain, a project to characterise piezoelectric materials for low power switches; S-PULSE, the EU Shrink-Path of Ultra-Low Power Superconducting Electronics initiative