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In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
In an EE380 talk, [31] [32] an Asus engineer mentioned that the Eee PC uses the keyboard shielding as a heat sink to absorb the heat generated by the processor. Three chips need heatsinking, and this is achieved by heat-conductive adhesive pads which sit between the chip heatsink flats and the keyboard shield and connect them thermally.
Zalman's product range includes heat sink and fan solutions for CPUs, as well as quiet power supplies, computer water cooling systems, motherboard chipset coolers, graphics card heatsink and fan combos, laptop coolers, cases, and hard disk cases that lower temperature and reduce noise.
Framework Laptop 16 is a larger laptop unveiled at the promotional Next Level keynote in March 2023. It is dubbed the "holy grail" of upgradeable laptops for engineers and gamers due to the new expansion bay that can attach PCIe components such as a dedicated GPU, as well as adapt the laptop's cooling system. [32]
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A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).