Search results
Results from the WOW.Com Content Network
Edwards Ltd is a British multinational vacuum pump and exhaust gas management systems manufacturer. Its headquarters are in Burgess Hill , UK, and has been part of the Atlas Copco Group since 2014. [ 12 ] [ 13 ] [ 1 ] Edwards holds 1,700 patents , including for dry (oil-free) vacuum pumps , and produces equipment used for manufacturing ...
Edwards Vacuum will be producing cryogenic pumping systems that are critical to the production of semiconductor chips and are contributing to a growing digital society.
Edwards has over 3,200 full-time employees and 500 temporary workers operating in approximately 30 countries worldwide engaged in the design, manufacture and support of high technology vacuum and ...
Systems on Silicon Manufacturing Company Pte. Ltd. (more commonly known as SSMC) is a Singaporean semiconductor fabrication company located in Pasir Ris Wafer Fab Park. It was incorporated in 1999 and is a joint venture between NXP Semiconductors (until 2006 Philips) and TSMC. Founded by Philips and EDB Investments, the plant was completed in ...
Samsung Electro-Mechanics (SEM, 삼성전기) is a multinational electronic component company headquartered in Suwon, Gyeonggi Province, South Korea. It is a subsidiary of the Samsung Group. The company produces chip parts such as MLCCs, semiconductor substrates, camera modules, network modules and printed circuit boards.
For premium support please call: 800-290-4726 more ways to reach us
A. G. Edwards, a full-service US securities broker-dealer; Edwards Lifesciences, a manufacturer of cardiovascular disease treatment equipment; Edwards Ltd, vacuum engineering business of Atlas Copco; Edwards Theaters, a movie theatre chain owned by Regal Entertainment Group; ESP Edwards Series, an electric guitar brand produced by the ESP ...
ASE provides semiconductor assembly and testing services for over 90 percent of electronics companies in the world. [10] The packaging services include fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip, 2.5D and 3D packaging, system in package (SiP) and copper wire bonding. [9] [11]