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The first of the cooling load factors used in this method is the CLTD, or the Cooling Load Temperature Difference. This factor is used to represent the temperature difference between indoor and outdoor air with the inclusion of the heating effects of solar radiation. [1] [5] The second factor is the CLF, or the cooling load factor.
Time temperature indicators are commonly used on food, pharmaceutical, and medical products to indicate exposure to excessive temperature (and time at temperature). [1] In contrast, a temperature data logger measures and records the temperatures for a specified time period. The digital data can be downloaded and analyzed.
This Wikipedia page provides a comprehensive list of boiling and freezing points for various solvents.
In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.
The wet-bulb globe temperature (WBGT) is a measure of environmental heat as it affects humans. Unlike a simple temperature measurement, WBGT accounts for all four major environmental heat factors: air temperature, humidity, radiant heat (from sunlight or sources such as furnaces), and air movement (wind or ventilation). [ 1 ]
where g is the number of degrees below the retort temperature on a simple heating curve at the end of the heating period, B B is the time in minutes from the beginning of the process to the end of the heating period, and f h is the time in minutes required for the straight-line portion of the heating curve plotted semilogarithmically on paper ...
These first Heisler–Gröber charts were based upon the first term of the exact Fourier series solution for an infinite plane wall: (,) = = [ + ], [1]where T i is the initial uniform temperature of the slab, T ∞ is the constant environmental temperature imposed at the boundary, x is the location in the plane wall, λ is the root of λ * tan λ = Bi, and α is thermal diffusivity.