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Inside a gaming case during gameplay. 360° photograph. A full tower case. Accessories shown include: a fan controller, a DVD burner, and a USB memory card reader.. Cases can come in many different sizes and shapes, which are usually determined by the form factor of the motherboard since it is physically the largest hardware component in most computers. Consequently, personal computer form ...
A mid-tower computer case from c. 2011. In personal computing, a tower unit, or simply a tower, is a form factor of desktop computer case whose height is much greater than its width, thus having the appearance of an upstanding tower block, as opposed to a traditional "pizza box" computer case whose width is greater than its height and appears lying flat.
A human computer, with microscope and calculator, 1952. It was not until the mid-20th century that the word acquired its modern definition; according to the Oxford English Dictionary, the first known use of the word computer was in a different sense, in a 1613 book called The Yong Mans Gleanings by the English writer Richard Brathwait: "I haue [] read the truest computer of Times, and the best ...
In oil drilling and borehole mining, a casing shoe or guide shoe is a bull-nose shaped device which is attached to the bottom of the casing string. A casing hanger , which allows the casing to be suspended from the wellhead, is attached to the top of the casing.
ATX is the most common motherboard design. [2] Other standards for smaller boards (including microATX, FlexATX, nano-ITX, and mini-ITX) usually keep the basic rear layout but reduce the size of the board and the number of expansion slots.
Alan Kay holding the mockup of his Dynabook concept in 2008. The history of the laptop follows closely behind the development of the personal computer itself. A "personal, portable information manipulator" was imagined by Alan Kay at Xerox PARC in 1968, [7] and described in his 1972 paper as the "Dynabook". [8]
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged.
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.