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  2. Four-die forging device - Wikipedia

    en.wikipedia.org/wiki/Four-die_forging_device

    The use of four-die forging devices in hydraulic forging presses provides for the following advantages in comparison with conventional methods of forging by two dies: Capability of forging low-ductility and hard-to-deform steels and alloys due to favourable stress and strain state of metal in the zone of deformation

  3. Strain engineering - Wikipedia

    en.wikipedia.org/wiki/Strain_engineering

    Strain can be induced in thin films with either epitaxial growth, or more recently, topological growth. Epitaxial strain in thin films generally arises due to lattice mismatch between the film and its substrate and triple junction restructuring at the surface triple junction, which arises either during film growth or due to thermal expansion mismatch. [5]

  4. Strained silicon - Wikipedia

    en.wikipedia.org/wiki/Strained_silicon

    Covering the NMOS transistor with a highly stressed silicon nitride layer is another way to create uniaxial tensile strain. As opposed to wafer-level methods of inducing strain on the channel layer prior to MOSFET fabrication, the aforementioned methods use strain induced during the MOSFET fabrication itself to alter the carrier mobility in the ...

  5. Strengthening mechanisms of materials - Wikipedia

    en.wikipedia.org/wiki/Strengthening_mechanisms...

    The construction of nanolaminated structure with low-angle grain boundaries is one method to obtain ultrafine grained materials with ultra-strength. Lu et al. [25] applied a very high rate shear deformation with high strain gradients on the top surface layer of bulk Ni sample and introduced nanolaminated structures. This material exhibits an ...

  6. Stress–strain analysis - Wikipedia

    en.wikipedia.org/wiki/Stress–strain_analysis

    Stress–strain analysis (or stress analysis) is an engineering discipline that uses many methods to determine the stresses and strains in materials and structures subjected to forces. In continuum mechanics , stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other ...

  7. Deformation (engineering) - Wikipedia

    en.wikipedia.org/wiki/Deformation_(engineering)

    By convention, the strain is set to the horizontal axis and stress is set to vertical axis. Note that for engineering purposes we often assume the cross-section area of the material does not change during the whole deformation process. This is not true since the actual area will decrease while deforming due to elastic and plastic deformation.

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  9. Dynamic strain aging - Wikipedia

    en.wikipedia.org/wiki/Dynamic_strain_aging

    Dynamic strain aging (DSA) for materials science is an instability in plastic flow of materials, associated with interaction between moving dislocations and diffusing solutes. Although sometimes dynamic strain aging is used interchangeably with the Portevin–Le Chatelier effect (or serrated yielding), dynamic strain aging refers specifically ...