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  2. Thin small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_small_outline_package

    An outline drawing of a Type I TSOP with 32 leads. Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.

  3. RAM limit - Wikipedia

    en.wikipedia.org/wiki/RAM_limit

    Bank switching allows blocks of RAM memory to be switched into the processor's address space when required, under program control. Operating systems routinely manage running programs using virtual memory, where individual program operate as if they have access to a large memory space that is being simulated by swapping memory areas with disk ...

  4. RDRAM - Wikipedia

    en.wikipedia.org/wiki/RDRAM

    Moreover, if a mainboard has a dual-or quad-channel memory subsystem, all of the memory channels must be upgraded simultaneously. 16-bit modules provide one channel of memory, while 32-bit modules provide two channels. Therefore, a dual-channel mainboard accepting 16-bit modules must have RIMMs added or removed in pairs.

  5. Memory module - Wikipedia

    en.wikipedia.org/wiki/Memory_module

    Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were ...

  6. MultiMediaCard - Wikipedia

    en.wikipedia.org/wiki/MultiMediaCard

    Typically, an MMC operates as a storage medium for devices, in a form that can easily be removed for access by a PC via a connected MMC reader. eMMC (embedded MMC) is a small MMC chip used as embedded non-volatile memory that is normally soldered on printed circuit boards, though pluggable eMMC modules are used on some devices (e.g. Orange Pi ...

  7. CAMM (memory module) - Wikipedia

    en.wikipedia.org/wiki/CAMM_(memory_module)

    Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]

  8. Solid-state storage - Wikipedia

    en.wikipedia.org/wiki/Solid-state_storage

    An illustration of the write amplification phenomenon in flash-based storage devices. Over time, advancements in central processing unit (CPU) speed has driven innovation in secondary storage technology. [7] One such innovation, flash memory, is a non-volatile storage medium that can be electrically erased and reprogrammed.

  9. Ferroelectric RAM - Wikipedia

    en.wikipedia.org/wiki/Ferroelectric_RAM

    The basic storage element is a ferroelectric capacitor. The capacitor can be polarized up or down by applying an electric field [18] Similar to ferroelectric RAM, but the atoms align themselves in the direction of an external magnetic force. This effect is used to store data Has non-volatile elements along with high speed SRAM