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The silicon to hydrogen bond is longer than the C–H bond (148 compared to 105 pm) and weaker (299 compared to 338 kJ/mol). Hydrogen is more electronegative than silicon hence the naming convention of silyl hydrides. Commonly the presence of the hydride is not mentioned in the name of the compound. Triethylsilane has the formula Et 3 SiH.
Covalent silicides and silicon compounds occur with hydrogen and the elements in groups 10 to 17. Transition metals form metallic silicides, with the exceptions of silver, gold and the group 12 elements. The general composition is M n Si or MSi n with n ranging from 1 to 6 and M standing for metal.
The Si–C bond connecting it to the rest of the molecule is reasonably strong, allowing it to remain while the rest of the molecule undergoes reactions, but is not so strong that it cannot be removed specifically when needed, for example by the fluoride ion, which is a very weak nucleophile for carbon compounds but a very strong one for ...
The covalent bonds in this material form extended structures, but do not form a continuous network. With cross-linking, however, polymer networks can become continuous, and a series of materials spans the range from Cross-linked polyethylene , to rigid thermosetting resins, to hydrogen-rich amorphous solids, to vitreous carbon, diamond-like ...
A polycarbonate is an oxocarbon dianion consisting of a chain of carbonate units, where successive carbonyl groups are directly linked to each other by shared additional oxygen atoms. That is, they are the conjugate bases of polycarbonic acids , the conceptual anhydrides of carbonic acid , or polymers of carbon dioxide .
A silicon–oxygen bond (Si−O bond) is a chemical bond between silicon and oxygen atoms that can be found in many inorganic and organic compounds. [1] In a silicon–oxygen bond, electrons are shared unequally between the two atoms , with oxygen taking the larger share due to its greater electronegativity .
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.
They are hydrosilanes, a class of compounds that includes compounds with Si−H and other Si−X bonds. All contain tetrahedral silicon and terminal hydrides. They only have Si−H and Si−Si single bonds. The bond lengths are 146.0 pm for a Si−H bond and 233 pm for a Si−Si bond.