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Adherence is the adhesive strength between photoresist and substrate. If the resist comes off the substrate, some features will be missing or damaged. Etching resistance Anti-etching is the ability of a photoresist to resist the high temperature, different pH environment or the ion bombardment in the process of post-modification. Surface tension
Etching processes use a resist, though in these typically the whole object is covered in the resist (called the "ground" in some contexts), which is then selectively removed from some parts. This is the case when a resist is used to prepare the copper substrate for champlevé enamels , where parts of the field are etched (with acid or ...
Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...
The resulting wafer is then "hard-baked" if a non-chemically amplified resist was used, typically at 120 to 180 °C [33] for 20 to 30 minutes. The hard bake solidifies the remaining photoresist, to make a more durable protecting layer in future ion implantation, wet chemical etching, or plasma etching.
In semiconductor fabrication, a resist is a thin layer used to transfer a circuit pattern to the semiconductor substrate which it is deposited upon. A resist can be patterned via lithography to form a (sub)micrometer-scale, temporary mask that protects selected areas of the underlying substrate during subsequent processing steps.
Lift-off is applied in cases where a direct etching of structural material would have undesirable effects on the layer below. Lift-off is a cheap alternative to etching in a research context, which permits a slower turn-around time. Finally, lifting off a material is an option if there is no access to an etching tool with the appropriate gases.
The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. The primary advantage of electron-beam lithography is that it can draw custom patterns (direct-write) with sub-10 nm resolution.
Photochemical machining (PCM), also known as photochemical milling or photo etching, is a chemical milling process used to fabricate sheet metal components using a photoresist and etchants to corrosively machine away selected areas. This process emerged in the 1960s as an offshoot of the printed circuit board industry.