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2. Solder ball - Wikipedia

   en.wikipedia.org/wiki/Solder_ball

   The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] The ball grid array, chip-scale package, and flip chip packages generally use solder ...

3. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...

4. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. ... A solder ball is spherical in shape ...

5. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.

6. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm; Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.

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8. Flip chip - Wikipedia

   en.wikipedia.org/wiki/Flip_chip

   A solder ball is deposited on each of the pads, in a process called wafer bumping; Chips are cut. Chips are flipped and positioned so that the solder balls are facing the connectors on the external circuitry. Solder balls are then remelted (typically using hot air reflow).

9. Couple Charged with Child Abuse After Botched Home ...

   www.aol.com/couple-charged-child-abuse-botched...

   A Missouri couple has been charged with child abuse after police claim they performed a circumcision on a child at their home despite not having the medical training to do so.