Ads
related to: solder ball grid tool kitsupplyhouse.com has been visited by 100K+ users in the past month
Search results
Results from the WOW.Com Content Network
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. [2] This has some practical advantages over other destructive techniques, such as cross sectioning, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be ...
Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm Micro ball grid array ( μBGA ): Ball spacing less than 1 mm Thin fine-pitch ball grid array ( TFBGA ): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] The ball grid array, chip-scale package, and flip chip packages generally use solder ...
Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
Ads
related to: solder ball grid tool kitsupplyhouse.com has been visited by 100K+ users in the past month