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2. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins than can be put on a dual in-line or flat package .

3. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm Micro ball grid array ( μBGA ): Ball spacing less than 1 mm Thin fine-pitch ball grid array ( TFBGA ): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm

4. Solder ball - Wikipedia

   en.wikipedia.org/wiki/Solder_ball

   The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] The ball grid array, chip-scale package, and flip chip packages generally use solder ...

5. Embedded wafer level ball grid array - Wikipedia

   en.wikipedia.org/wiki/Embedded_Wafer_Level_Ball...

   Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...

6. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

7. Integrated circuit packaging - Wikipedia

   en.wikipedia.org/wiki/Integrated_circuit_packaging

   However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8] Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types.

8. After 5-Year-Old Packs Her Own Lunch, Mom Shares Hilarious ...

   www.aol.com/lifestyle/5-old-packs-her-own...

   Madi Cochrane showing what her 5-year-old daughter packed in her lunch box For mother of four and TikTok creator Madi Cochrane, packing lunches is a family affair.

9. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Head-in-pillow defects, or incomplete coalescence of ball grid array (BGA) sphere and solder paste deposit, is a failure mode that has seen increased frequency since the transition to lead-free soldering.