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Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. [13] Low-temperature eutectic solder with high strength. [12] Particularly strong, very brittle. [11] Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature
Hot-bar reflow is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element (called a thermode) to a temperature sufficient to melt the solder. Pressure is applied through the entire process (usually 15 seconds) to ensure that components stay in place during cooling.
One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.
Low vapor pressure, suitable for vacuum work. Good ductility. Also classified as a solder. Lowest melting point alloy with low vapor pressure. 80: 20: Au 88 Ge 12: Au 356 [54] – Au88, Indalloy 183, Premabraze 880, Georo. Eutectic. Low ductility. Used for die attachment of some chips. The high temperature may be detrimental to the chips and ...
Nickel improves ductility. Silver lowers melting point but worsens corrosion resistance. To maintain corrosion resistance, gold must be kept above 60%. High-temperature strength and corrosion resistance can be improved by further alloying, e.g., with chromium, palladium, manganese, and molybdenum. Added vanadium allows wetting ceramics.
The reflow soldering of through-hole components using solder paste in a convection oven process is called intrusive soldering. The goal of the reflow process is for the solder paste to reach the eutectic temperature at which the particular solder alloy undergoes a phase change to a liquid or molten state.
Lead-free solder glasses with soldering temperature of 450 °C (842 °F) were also developed. Phosphate glasses with low melting temperature were developed. One of such compositions is phosphorus pentoxide, lead(II) oxide, and zinc oxide, with addition of lithium and some other oxides. [19] Electrically conductive glass solders can be also ...