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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

3. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Soldering (US: / ˈ s ɒ d ər ɪ ŋ /; UK: / ˈ s oʊ l d ər ɪ ŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.

5. Graping - Wikipedia

   en.wikipedia.org/wiki/Graping

   Lead-free reflow soldering temperatures are higher, which results in more graping. Graping is also caused by increased surface oxidation. The increased surface oxidation is the result of smaller printed paste deposit volumes that cause a diminished surface area to flux ratio of the solder particle, resulting in flux exhaustion.

6. Copper tubing - Wikipedia

   en.wikipedia.org/wiki/Copper_tubing

   Solder fittings are smooth and easily slip onto the end of a tubing section. The joint is then heated using a torch, and the solder is melted into the connection. When the solder cools, it forms a very strong bond that can last for decades. Solder-connected rigid copper is the most popular choice for water supply lines in modern buildings.

7. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   Ideally, a solder paste should have, at minimum, a 4-hour stencil life. The stencil life is defined as a time period in which there will be no significant change in the solder paste material characteristics. A solder paste with a longer stencil life will be more robust in the printing process.

8. Bead probe technology - Wikipedia

   en.wikipedia.org/wiki/Bead_probe_technology

   Solder paste is applied to the location and reflowed. During reflow, solder flows and is drawn to the copper trace. Surface tension causes the bead to have a curved surface and rise above the solder mask, where it solidifies into a Bead Probe. The bead will be roughly obround in shape and may be 15-25 mils long. A properly constructed bead is ...

9. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Dispensed solder paste on the pads of a QFPs Mask and spheres for reballing. Heating a single SMD with a hot-air gun to melt all solder joints between it and the PCB is usually the first step, followed by removing the SMD while the solder is molten. The pad array on the conductor board should then be cleaned of old solder.