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2. Dye-and-pry - Wikipedia

   en.wikipedia.org/wiki/Dye-and-Pry

   Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. [2] This has some practical advantages over other destructive techniques, such as cross sectioning, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be ...

3. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.

4. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

5. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm; Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm

6. Head-in-pillow defect - Wikipedia

   en.wikipedia.org/wiki/Head-in-pillow_defect

   For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit ...

7. Point-to-point construction - Wikipedia

   en.wikipedia.org/wiki/Point-to-point_construction

   Section of a typical Australian late 1930s radio, showing the point to point construction between components. In electronics, point-to-point construction is a non-automated technique for constructing circuits which was widely used before the use of printed circuit boards (PCBs) and automated assembly gradually became widespread following their introduction in the 1950s.

8. The Secret to Making Monday Your Most Productive Day of ... - AOL

   www.aol.com/secret-making-monday-most-productive...

   Or start with the smallest task. On the other hand, some people feel more productive when they tackle little jobs first. A sense of accomplishment early in the day can drive the rest of your work.

9. Pad cratering - Wikipedia

   en.wikipedia.org/wiki/Pad_cratering

   It is a useful test for all pad geometries and is sensitive to board design and materials. The ball pull test is specifically design for BGA components and has a large sensitivity to the solder alloy and joint formation. The ball shear test is also specified for BGA components and involves shearing the solder balls of the BGA.