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Standard Test Method for Electrical Indication of Concrete's Ability to Resist Chloride Ion Penetration. ASTM Standard C1202-10. Standard Test Method for Surface Resistivity of Concrete's Ability to Resist Chloride Ion Penetration. Washington, D.C., USA: American Association of State Highway and Transportation Officials. 2011. AASHTO TP 95.
Flexible substrates typically have thinner metalization. Metal-core boards for high power devices commonly use thicker copper; 35 μm is usual but also 140 and 400 μm can be encountered. In the US, copper foil thickness is specified in units of ounces per square foot (oz/ft 2), commonly referred to simply as ounce.
Concrete has a very low coefficient of thermal expansion, and as it matures concrete shrinks. All concrete structures will crack to some extent, due to shrinkage and tension. Concrete which is subjected to long-duration forces is prone to creep. The density of concrete varies, but is around 2,400 kilograms per cubic metre (150 lb/cu ft). [1]
Coating material (after curing) should have a thickness of 30–130 μm (0.0012–0.0051 in) when using acrylic resin, epoxy resin, or urethane resin. For silicone resin, the coating thickness recommended by the IPC standards is 50–210 μm (0.0020–0.0083 in).
AMC.0 is the "base" or "core" specification. The AdvancedMC definition alone defines a protocol agnostic connector to connect to a carrier card or a backplane. Intermediate revisions are known as engineering change notices, or ECNs. [1] R1.0 adopted January 3, 2005 ECN-001 adopted June 2006 R2.0 adopted November 15, 2006
IPC standards revised the definition of a microvia in 2013 to a hole with depth to diameter aspect ratio of 1:1 or less, and the hole depth not to exceed 0.25mm. Previously, microvia was any hole less than or equal to 0.15mm in diameter [2]
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.
Typically used for server-class type motherboards with dual processors and too much circuitry for a standard E.ATX motherboard. LPX: Western Digital? 229 × 279–330 mm (9 × 11–13 in) Based on a design by Western Digital, it allowed smaller cases than the AT standard, by putting the expansion card slots on a Riser card. Used in slimline ...