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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
To do this, the company went on an aggressive recruitment spree to attract young engineering university graduates. In 1981, it launched a conversion kit that enabled manual aluminum wire bonder to operate semi-automatically. By 1984, it launched its fully-automatic wire bonders. In 1985, ASMPT produced its first die bonder aimed at LED ...
Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry . Wedge bonding is directional, so the bonding head rotates to accommodate the different angles for bonding.
A high-voltage electric charge is applied to the wire. This melts the wire at the tip of the capillary. The tip of the wire forms into a ball because of the surface tension of the molten metal. Ball bonding processes including (1) ball formation and (2) ball bond formation Ball bonding processes including (3) loop formation and (4) tail bond ...
Alexander Coucoulas is an American inventor, research engineer, and author. He was named "father of thermosonic bonding" by George Harman, [1] the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics.
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Gaps are formed as the denser and faster-growing layers consume the slower-growing layers. This process is known as the Kirkendall voiding, which leads to both increased electrical resistance and mechanical weakening of the wire bond. When the voids forms along the diffusion front, this process is aided by contaminants present in the lattice ...
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