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  2. 2N7000 - Wikipedia

    en.wikipedia.org/wiki/2N7000

    The 2N7002 variant is packaged in a TO-236 surface-mount package. The 2N7000 is an N-channel, enhancement-mode MOSFET used for low-power switching applications. [1] The 2N7000 is a widely available and popular part, often recommended as useful and common components to have around for hobbyist use. [2]

  3. Attenuator (electronics) - Wikipedia

    en.wikipedia.org/wiki/Attenuator_(electronics)

    An RF microwave attenuator. Key specifications for attenuators are: [2] Attenuation expressed in decibels of relative power. A 3 dB pad reduces power to one half, 6 dB to one fourth, 10 dB to one tenth, 20 dB to one hundredth, 30 dB to one thousandth and so on.

  4. Thin shrink small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_Shrink_Small_Outline...

    They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operational amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.

  5. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead. TAB: Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs. COG: Chip-on-glass

  6. Hirose U.FL - Wikipedia

    en.wikipedia.org/wiki/Hirose_U.FL

    Hirose U.FL, I-PEX MHF I [a], AMC [2] or UMCC [b] is a miniature RF connector for high-frequency signals up to 6 GHz manufactured by Hirose Electric Group, [3] I-PEX, [4] and others. U.FL connectors are commonly used in applications where space is of critical concern, such as in smartphones and laptop Wi-Fi cards.

  7. Quad flat package - Wikipedia

    en.wikipedia.org/wiki/Quad_Flat_Package

    A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. [1] Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile ...

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