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The 2005 Farnell/Newark InOne "RoHS Legislation and Technical Manual", [52] cites these and other "lead-free" solder issues, such as: Warping or delamination of printed circuit boards; Damage to through-holes, ICs and components on circuit boards; and, Added moisture sensitivity, all of which may compromise quality and reliability.
China RoHS II expanded the product scope of China RoHS I from Electronic Information Products (EIP) to Electrical and Electronic Products (EEP). [3] Products listed in the EEP Catalogue must comply with hazardous substance restriction limits for lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated ...
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
Sun Fire X4100 cluster Sun Fire X4150 Motherboard Sun Fire X4200 servers. Sun Fire is a series of server computers introduced in 2001 by Sun Microsystems (since 2010, part of Oracle Corporation). The Sun Fire branding coincided with the introduction of the UltraSPARC III processor, superseding the UltraSPARC II-based Sun Enterprise series.
C7-D: similar to original C7, but RoHS-compliant [1] and marketed as "carbon-free processor". Some variants do not support PowerSaver [ citation needed ] Eden : Some VIA Eden CPUs are based on a C7 core with low power consumption, package size, and clock rates as low as 400 MHz.
RoHS Directive: In 2003, the EC not only implemented legislation on waste collection but also on the alternative use of hazardous materials (Cadmium, mercury, flammable materials, polybrominated biphenyls, lead and polybrominated diphenyl ethers) used in the production of electronic and electric equipment (RoHS Directive 2002/95/EC ).
The first motherboard produced in this form factor is called EPIA PX10000G. It is 10 × 7.2 cm (3.9 × 2.8 in) and the printed circuit board is 10 layers deep. The operating temperature range is from 0 to about 50 °C (32 to about 122 °F). The operating humidity level (relative and non-condensing) can be from 0% to about 95%.
Under the Hub Architecture, a motherboard would have a two piece chipset consisting of a northbridge chip and a southbridge chip. Over time, the speed of CPUs kept increasing but the bandwidth of the front-side bus (FSB) (connection between the CPU and the motherboard) did not, resulting in a performance bottleneck.
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