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(Reuters) -The European Medicines Agency (EMA) is investigating Novo Nordisk's diabetes drug Ozempic and weight-loss treatment Saxenda after Iceland's health regulator flagged three cases of ...
1. Pancreatitis. Pancreatitis (inflammation of the pancreas) was reported in clinical trials on Ozempic. But the results weren’t conclusive. If pancreatitis is indeed a risk, it seems to be ...
Image credits: Stewart Cook/ABC/Getty Images While Ozempic is not approved for weight loss, some physicians prescribe it for this purpose, as per UC Davis Health.. Ozempic can help with weight ...
Sonication can be used for the production of nanoparticles, such as nanoemulsions, [5] nanocrystals, liposomes and wax emulsions, as well as for wastewater purification, degassing, extraction of seaweed polysaccharides [1] and plant oil, extraction of anthocyanins and antioxidants, [6] production of biofuels, crude oil desulphurization, cell disruption, polymer and epoxy processing, adhesive ...
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
A circular filter paper is taken and the sample is deposited at the center of the paper. After drying the spot, the filter paper is tied horizontally on a Petri dish containing solvent, so that the wick of the paper is dipped in the solvent. The solvent rises through the wick and the components are separated into concentric rings.
A particle counter is used for monitoring and diagnosing particle contamination within specific clean media, including air, water and chemicals. Particle counters are used in a variety of applications in support of clean manufacturing practices, industries include: electronic components and assemblies, pharmaceutical drug products and medical devices, and industrial technologies such as oil ...
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers predominantly used today have diameters of 200 and 300 mm.
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