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  2. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  3. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Perimeter lands on the package bottom provide electrical connections to the PCB. [1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. [2]

  4. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.

  5. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.

  7. Surface finish - Wikipedia

    en.wikipedia.org/wiki/Surface_finish

    Surface finish, also known as surface texture or surface topography, is the nature of a surface as defined by the three characteristics of lay, surface roughness, and waviness. [1] It comprises the small, local deviations of a surface from the perfectly flat ideal (a true plane ).

  8. Gold plating - Wikipedia

    en.wikipedia.org/wiki/Gold_plating

    Gold plated - gold layer thickness greater than or equal to 0.5 micron; Heavy gold plated / Vermeil - gold layer thickness greater than or equal to 2.5 micron; Gold plated silver jewellery can still tarnish as the silver atoms diffuse into the gold layer, causing slow gradual fading of its color and eventually causing tarnishing of the surface ...

  9. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    2. Typically, thermocompression bonds are made with delivering heat and pressure to the mating surface by a hard faced bonding tool. Compliant bonding [11] is a unique method of forming this type of solid state bond between a gold lead and a gold surface since heat and pressure is transmitted through a compliant or deformable media. The use of ...

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