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Plasma cutting. Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops ...
Plasma torch. A plasma torch cutter. A plasma torch (also known as a plasma arc, plasma gun, plasma cutter, or plasmatron) is a device for generating a directed flow of plasma. [1][2][3] The plasma jet can be used for applications including plasma cutting, plasma arc welding, plasma spraying, and plasma gasification for waste disposal. [4]
To give an idea of the flow rate while plasma cutting: The flow of a Hypertherm plasma 260A for mild steel uses 42 l/min for the plasma gas (O2) and 104 l/min for the shield gas (air). The hole in the nozzle is about 2mm². Source: Hypertherm HPR260 manual. Devaes 08:36, 14 January 2008 (UTC) Reply
Plasma arc welding (PAW) is an arc welding process similar to gas tungsten arc welding (GTAW). The electric arc is formed between an electrode (which is usually but not always made of sintered tungsten) and the workpiece. The key difference from GTAW is that in PAW, the electrode is positioned within the body of the torch, so the plasma arc is ...
An expansion of the 400 Bad Request response code, used when a client certificate is required but not provided. 497 HTTP Request Sent to HTTPS Port. An expansion of the 400 Bad Request response code, used when the client has made a HTTP request to a port listening for HTTPS requests. 499 Client Closed Request.
Plasma activation. Plasma activation (or plasma functionalization) is a method of surface modification employing plasma processing, which improves surface adhesion properties of many materials including metals, glass, ceramics, a broad range of polymers and textiles and even natural materials such as wood and seeds.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
The function was tabulated by Vera Faddeeva and N. N. Terentyev in 1954. [8] It appears as nameless function w(z) in Abramowitz and Stegun (1964), formula 7.1.3. The name Faddeeva function was apparently introduced by G. P. M. Poppe and C. M. J. Wijers in 1990; [9] [better source needed] previously, it was known as Kramp's function (probably after Christian Kramp).
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