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  2. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...

  3. Bi-pin lamp base - Wikipedia

    en.wikipedia.org/wiki/Bi-pin_lamp_base

    The suffix after the G indicates the pin spread; the G dates to the use of Glass for the original bulbs. GU usually also indicates that the lamp provides a mechanism for physical support by the luminaire: in some cases, each pin has a short section of larger diameter at the end (sometimes described as a "peg" rather than a "pin" [2]); the socket allows the bulb to lock into place by twisting ...

  4. MicroLED - Wikipedia

    en.wikipedia.org/wiki/MicroLED

    On 12 September 2019, Sony announced Crystal LED availability to consumers ranging from 1080p 110-inch (2.8 m) to 16K 790-inch (20 m) displays. [81] Samsung demonstrated a 146-inch (3.7 m) microLED display called The Wall at CES 2018. [82] In July 2018, Samsung announced plans on bringing a 4K microLED TV to consumer market in 2019. [83]

  5. LED lamp - Wikipedia

    en.wikipedia.org/wiki/LED_lamp

    A 230-volt LED filament lamp, with an E27 base. The filaments are visible as the eight yellow vertical lines. An assortment of LED lamps commercially available in 2010: floodlight fixtures (left), reading light (center), household lamps (center right and bottom), and low-power accent light (right) applications An 80W Chips on board (COB) LED module from an industrial light luminaire, thermally ...

  6. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    Weight per wafer 100 mm2 (10 mm) Die per wafer 1-inch (25 mm) 1960 2-inch (51 mm) 275 μm: 1969 9 3-inch (76 mm) 375 μm 1972 29 4-inch (100 mm) 525 μm 1976 10 grams [18] 56 4.9 inch (125 mm) 625 μm 1981 95 150 mm (5.9 inch, usually referred to as "6 inch") 675 μm 1983 144 200 mm (7.9 inch, usually referred to as "8 inch") 725 μm.

  7. Wafer bonding - Wikipedia

    en.wikipedia.org/wiki/Wafer_bonding

    Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...

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