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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm; Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
To replace IEEE 200-1975, ASME, a standards body for mechanical engineers, initiated the new standard ASME Y14.44-2008. This standard, along with IEEE 315-1975, provide the electrical designer with guidance on how to properly reference and annotate everything from a single circuit board to a collection of complete enclosures.
The information about the standards for stencil design is available at IPC Specification 7525 and other standards. In general, including stencils with tall and narrow apertures, an area ratio greater than 0.66 is recommended. Illustrations of the various dimensions:
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...
Moisture sensitivity levels are specified in technical standard IPC/JEDEC Moisture/reflow Sensitivity Classification for Nonhermetic Surface-Mount Devices. [1] The times indicate how long components can be outside of dry storage before they have to be baked to remove any absorbed moisture. MSL 6 – Mandatory bake before use; MSL 5A – 24 hours
Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board.
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...
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