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  2. Contact image sensor - Wikipedia

    en.wikipedia.org/wiki/Contact_image_sensor

    Contact image sensors (CIS) are image sensors used in flatbed scanners almost in direct contact with the object to be scanned. Charge-coupled devices (CCDs), the other kind of sensor often used in scanners, use mirrors to bounce light to a stationary sensor.

  3. sCMOS - Wikipedia

    en.wikipedia.org/wiki/SCMOS

    sCMOS (scientific Complementary Metal–Oxide–Semiconductor) are a type of CMOS image sensor (CIS). [1] These sensors are commonly used as components in specific observational scientific instruments, such as microscopes [2] and telescopes. [3] sCMOS image sensors offer extremely low noise, rapid frame rates, wide dynamic range, high quantum ...

  4. Image scanner - Wikipedia

    en.wikipedia.org/wiki/Image_scanner

    Scanner unit with CIS. A: assembled, B: disassembled; 1: housing, 2: light conductor, 3: lenses, 4: chip with two RGB-LEDs, 5: CIS. Scanners equipped with contact image sensor (CIS) scanning elements are designed to be in near-direct contact with the document to be scanned and thus do not require the complex optics of CCDs scanners. However ...

  5. Photodetector - Wikipedia

    en.wikipedia.org/wiki/Photodetector

    CMOS Image Sensors (CIS): CMOS image sensors are based on complementary metal-oxide-semiconductor (CMOS) technology. They integrate photodetectors and signal processing circuitry on a single chip. CMOS image sensors have gained popularity due to their low power consumption, high integration, and compatibility with standard CMOS fabrication ...

  6. Image sensor - Wikipedia

    en.wikipedia.org/wiki/Image_sensor

    CCD sensors are used for high end broadcast quality video cameras, and CMOS sensors dominate in still photography and consumer goods where overall cost is a major concern. Both types of sensor accomplish the same task of capturing light and converting it into electrical signals. Each cell of a CCD image sensor is an analog device.

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  8. Through-silicon via - Wikipedia

    en.wikipedia.org/wiki/Through-silicon_via

    CMOS image sensors (CIS) were among the first applications to adopt TSV(s) in volume manufacturing. In initial CIS applications, TSVs were formed on the backside of the image sensor wafer to form interconnects, eliminate wire bonds, and allow for reduced form factor and higher-density interconnects.

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