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  2. File:Temperature-entropy chart for steam, imperial units.svg

    en.wikipedia.org/wiki/File:Temperature-entropy...

    Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.

  3. File:Pressure-enthalpy chart for steam, in US units.svg

    en.wikipedia.org/wiki/File:Pressure-enthalpy...

    Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.

  4. File:Mollier enthalpy entropy chart for steam - US units.svg

    en.wikipedia.org/wiki/File:Mollier_enthalpy...

    Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.

  5. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...

  6. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:

  7. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

  8. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    A heat sink is not a device with the "magical ability to absorb heat like a sponge and send it off to a parallel universe". [2] Natural convection requires free flow of air over the heat sink. If fins are not aligned vertically, or if fins are too close together to allow sufficient air flow between them, the efficiency of the heat sink will ...

  9. Computer fan - Wikipedia

    en.wikipedia.org/wiki/Computer_fan

    A case fan may be mounted on a radiator attached to the case, simultaneously operating to cool a liquid cooling device's working fluid and to ventilate the case. In laptops, a single blower fan often cools a heat sink connected to both CPU and GPU using heat pipes. In gaming laptops and mobile workstations, two or more heavy duty fans may be used.