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Laser cutting works by directing the output of a high-power laser most commonly through optics. The laser optics and CNC (computer numerical control) are used to direct the laser beam to the material. A commercial laser for cutting materials uses a motion control system to follow a CNC or G-code of the pattern to be cut onto the material.
where t is the depth of cut, P is the laser beam power, v is the cutting velocity, and d is the laser beam spot diameter. [5] The depth of the cut is also influenced by the workpiece material. The material's reflectivity, density, specific heat, and melting point temperature all contribute to the lasers ability to cut the workpiece.
Laser printing is an electrostatic digital printing process. It produces high-quality text and graphics (and moderate-quality photographs) by repeatedly passing a laser beam back and forth over a negatively charged cylinder called a "drum" to define a differentially charged image. [1]
This emission is in the thermal infrared at 10.6 μm; such lasers are regularly used in industry for cutting and welding. The efficiency of a CO 2 laser is unusually high: over 30%. [64] Argon-ion lasers can operate at several lasing transitions between 351 and 528.7 nm. Depending on the optical design one or more of these transitions can be ...
Laser ablation or photoablation (also called laser blasting [1] [2] [3]) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates .
Much laser engraving is sold as exposed brass or silver-coated steel lettering on a black or dark-enamelled background. A wide variety of finishes are now available, including screen-printed marble effects on the enamel. Anodized aluminum is commonly engraved or etched with CO 2 laser machines. With power less than 40W this metal can easily be ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
In textile manufacturing, a laser cutting bridge system is an industrial machine for cutting and engraving textile materials (i.e. fabrics). It is formed by a galvanometric laser head and carbon-dioxide laser (CO 2 laser) source that runs along an horizontal beam (the bridge) supported by two lateral columns and sometimes by central columns.
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