Search results
Results from the WOW.Com Content Network
It is used to deposit copper and other conductors in forming printed circuit boards and copper interconnects in integrated circuits. It is also used to purify metals such as copper. The aforementioned electroplating of metals uses an electroreduction process (that is, a negative or cathodic current is on the working
Excluding the continuous strip plating industry, copper is the second most commonly-plated metal after nickel. [6] Copper electroplating offers a number of advantages over other plating processes, including low metal cost, high-conductivity and high-ductility bright finish, and high plating efficiency.
Zinc plating was developed, and continues to evolve, to meet the most challenging corrosion protection, temperature, and wear resistance requirements. Electroplating of zinc was invented in 1800 but the first bright deposits were not obtained until the early 1930s with the alkaline cyanide electrolyte.
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [19]
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]
Greene also posted what she described as a map of areas affected by Helene – in states including Florida, Georgia and the Carolinas — with an overlay showing the area is home to a majority of ...
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
It is also possible to form coatings of newer materials (e.g., met glass. beta-C 3 N 4), graded deposits, multi-component deposits etc. The advanced materials and deposition processes including recent developments in ultra hard materials like BAM (AlMgB compound)are fully covered in a recent book[R. Chattopadhyay:Green Tribology,Green Surface ...