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It is filled with a sample of the plating solution and an appropriate anode which is connected to a rectifier. The "work" is replaced with a Hull cell test panel that will be plated to show the "health" of the bath. The Hull cell is a trapezoidal container that holds 267 milliliters of a plating bath solution.
The cathode efficiency depends on the process and varies between 90 and 97%. Due to this mismatch, during the plating the nickel concentration in the solution and the pH will slowly rise. [6] The process takes minutes to hours depending on the current density and the intended thickness of the plating. [7]
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The main ingredients of an electroless nickel plating bath are source of nickel cations Ni 2+, usually nickel sulfate and a suitable reducing agent, such as hypophosphite H 2 PO − 2 or borohydride BH − 4. [1] With hypophosphite, the main reaction that produces the nickel plating yields orthophosphite H 2 PO − 3, elemental phosphorus ...
A sulfate-based bath that uses insoluble catalytic anodes, which maintains an electrode potential that prevents oxidation. The trivalent chromium-plating process can plate the workpieces at a similar temperature, rate and hardness, as compared to hexavalent chromium. Plating thickness ranges from 5 to 50 μin (0.13 to 1.27 μm). [2]
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