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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
A MIL-DTL-38999 circular connector plated with a nickel–teflon composite. Left: plug (male) type connector; Right: receptacle (female) type connector) Electrical or fiber-optic connectors used by U.S. Department of Defense were originally developed in the 1930s for severe aeronautical and tactical service applications, and the Type "AN" series set the standard for modern military circular ...
Gold plated - gold layer thickness greater than or equal to 0.5 micron; Heavy gold plated / Vermeil - gold layer thickness greater than or equal to 2.5 micron; Gold plated silver jewellery can still tarnish as the silver atoms diffuse into the gold layer, causing slow gradual fading of its color and eventually causing tarnishing of the surface ...
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Electrodes in connectors are usually made of copper alloys, due to their good conductivity and malleability. [7]: 15 Alternatives include brass, phosphor bronze, and beryllium copper. The base electrode metal is often coated with another inert metal such as gold, nickel, or tin. [8]
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.
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When the base is pressed of lead glass the Dumet-wire and a short part of the nickel and the copper wire are enclosed in the glass. Then the nickel wire and the glass around the Dumet-wire are heated by a gas flame and the glass seals to the Dumet-wire. The nickel and copper do not seal vacuum tight to the glass but are mechanically supported.
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