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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Tantalum electrolytic capacitors, usually used in the SMD (surface-mount device) version, have a higher specific capacitance than the aluminium electrolytic capacitors and are used in devices with limited space or flat design such as laptops. They are also used in military technology, mostly in axial style, hermetically sealed.
SMD capacitors (on the left) with two through-hole capacitors (on the right) Main article: Chip carrier Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans.
The predominant application of all electrolytic capacitors is in power supplies.They are used in input and output smoothing capacitors, as decoupling capacitors to circulate the harmonic current in a short loop, as bypass capacitors to shunt AC noise to the ground by bypassing the power supply lines, as backup capacitors to mitigate the drop in line voltage during sudden power demand or as ...
After the 1980s, surface mount packages for capacitors have been widely used. These packages are extremely small and lack connecting leads, allowing them to be soldered directly onto the surface of printed circuit boards. Surface mount components avoid undesirable high-frequency effects due to the leads and simplify automated assembly, although ...
Integrated Passive Device versus Discrete Surface Mount Devices (SMD) 3D passive integration in silicon is one of the technologies used to manufacture Integrated Passive Devices (IPDs), enabling high-density trench capacitors, metal-insulator-metal (MIM) capacitors, resistors, high-Q inductors, PIN, Schottky or Zener diodes to be implemented in ...
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