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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

  3. Electronic packaging - Wikipedia

    en.wikipedia.org/wiki/Electronic_packaging

    Glob-top is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy [3] or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly ...

  4. Chip-scale package - Wikipedia

    en.wikipedia.org/wiki/Chip-scale_package

    Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC 's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology , in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct ...

  5. The real reason potato chip bags are never filled to the top

    www.aol.com/real-reason-potato-chip-bags...

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  6. Exclusive-Nvidia pursues $30 billion custom chip opportunity ...

    www.aol.com/news/exclusive-nvidia-chases-30...

    650 Group's Weckle expects the telecom custom chip market to remain flat at roughly $4 billion to $5 billion a year. Nvidia also plans to target the automotive and video game markets, according to ...

  7. ISO/IEC 7810 - Wikipedia

    en.wikipedia.org/wiki/ISO/IEC_7810

    ID-000 size card as part of ID-1 size card [ edit ] An "informative" (i.e. non-mandatory) annex [ 7 ] describes how an ID-000 sized card may be included in an ID-1 size card for processing (e.g. in an ID-1 reader), but with "relief areas around the perimeter of the ID-000 size card to allow it to be removed from the ID-1 size card without ...

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  9. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Testing is carried out to prevent faulty chips from being assembled into relatively expensive packages. The yield is often but not necessarily related to device (die or chip) size. As an example, in December 2019, TSMC announced an average yield of ~80%, with a peak yield per wafer of >90% for their 5nm test chips with a die size of 17.92 mm 2.

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