Search results
Results from the WOW.Com Content Network
Simplified diagram for electroplating copper (orange) on a conductive object (the cathode, "Me", gray). The electrolyte is a solution of copper sulfate, CuSO 4 in sulfuric acid. A copper anode is used to replenish the electrolyte with copper cations Cu 2+ as they are plated out at the cathode.
Schematic apparatus for electrotyping. An electric current flows from the battery, through the copper anode, the electrolyte, and the coated mold. A copper film (the electrotype) grows onto the electrically conducting coating of the mold. Electrotyping (also galvanoplasty) is a chemical method for forming metal parts that exactly reproduce a model.
Electrochemical machining (ECM) diagram. 1: Pump 2: Anode (workpiece) 3: Cathode (tool) 4: Electric current 5: Electrolyte 6: Electrons 7: Metal hydroxide. Electrochemical machining (ECM) is a method of removing metal by an electrochemical process.
Excluding the continuous strip plating industry, copper is the second most commonly-plated metal after nickel. [6] Copper electroplating offers a number of advantages over other plating processes, including low metal cost, high-conductivity and high-ductility bright finish, and high plating efficiency.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]
A schematic, or schematic diagram, is a designed representation of the elements of a system using abstract, graphic symbols rather than realistic pictures. A schematic usually omits all details that are not relevant to the key information the schematic is intended to convey, and may include oversimplified elements in order to make this essential meaning easier to grasp, as well as additional ...
A schematic of a typical slot-die coating system. Slot-die coating equipment is available in a variety of configurations and form factors. However, the vast majority of slot-die processes are driven by a similar set of common core components. These include: A fluid reservoir to store the main supply of coating fluid for the system
LIGA consists of three main processing steps: lithography, electroplating, and molding. There are two main LIGA-fabrication technologies: X-Ray LIGA, which uses X-rays produced by a synchrotron to create high-aspect-ratio structures, and UV LIGA, a more accessible method which uses ultraviolet light to create structures with relatively low aspect ratios.