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Simplified diagram for electroplating copper (orange) on a conductive object (the cathode, "Me", gray). The electrolyte is a solution of copper sulfate, CuSO 4 in sulfuric acid. A copper anode is used to replenish the electrolyte with copper cations Cu 2+ as they are plated out at the cathode.
Schematic apparatus for electrotyping. An electric current flows from the battery, through the copper anode, the electrolyte, and the coated mold. A copper film (the electrotype) grows onto the electrically conducting coating of the mold. Electrotyping (also galvanoplasty) is a chemical method for forming metal parts that exactly reproduce a model.
Electrochemical machining (ECM) diagram. 1: Pump 2: Anode (workpiece) 3: Cathode (tool) 4: Electric current 5: Electrolyte 6: Electrons 7: Metal hydroxide. Electrochemical machining (ECM) is a method of removing metal by an electrochemical process.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]
The figure shows the schematic P-T diagram of a pure substance (as opposed to mixtures, which have additional state variables and richer phase diagrams, discussed below). The commonly known phases solid , liquid and vapor are separated by phase boundaries, i.e. pressure–temperature combinations where two phases can coexist.
A schematic diagram of the Blasius flow profile. The streamwise velocity component () / is shown, as a function of the similarity variable .. Using scaling arguments, Ludwig Prandtl [1] argued that about half of the terms in the Navier-Stokes equations are negligible in boundary layer flows (except in a small region near the leading edge of the plate).
A module with two input streams at the top, an AND output bucket in the middle, and an XOR output stream at the bottom.. Fluidics, or fluidic logic, is the use of a fluid to perform analog or digital operations similar to those performed with electronics.
Poroelasticity is a field in materials science and mechanics that studies the interaction between fluid flow, pressure and bulk solid deformation within a linear porous medium and it is an extension of elasticity and porous medium flow (diffusion equation). [1] The deformation of the medium influences the flow of the fluid and vice versa.