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  2. Dip soldering - Wikipedia

    en.wikipedia.org/wiki/Dip_soldering

    The solder wets to the exposed metallic areas of the board (those not protected with solder mask), creating a reliable mechanical and electrical connection. Dip soldering is used for both through-hole printed circuit assemblies, and surface mount. It is one of the cheapest methods to solder and is extensively used in the small scale industries ...

  3. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device that is metallized at its ends. MELF devices are usually diodes and resistors. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]

  4. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

  5. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

  6. Reflow soldering - Wikipedia

    en.wikipedia.org/wiki/Reflow_soldering

    Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology (SMT) components to a printed circuit board (PCB). Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly.

  7. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

  8. Wave soldering - Wikipedia

    en.wikipedia.org/wiki/Wave_soldering

    The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount.

  9. SMD LED - Wikipedia

    en.wikipedia.org/wiki/SMD_LED

    The light from white LED lamps and LED strip lights is usually provided by industry standard surface-mounted device LEDs (SMD LEDs). [2] Non-SMD types of LED lighting also exist, such as COB (chip on board) and MCOB (multi-COB). Surface-mounted device LED modules are described by the dimensions of the LED package. A single multicolor module may ...

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