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2. EasyEDA - Wikipedia

   en.wikipedia.org/wiki/EasyEDA

   EasyEDA is a web-based EDA tool suite that enables hardware engineers to design, simulate, share - publicly and privately - and discuss schematics, simulations and printed circuit boards. Other features include the creation of a bill of materials, Gerber files and pick and place files and documentary outputs in PDF, PNG and SVG formats.

3. Printed circuit board - Wikipedia

   en.wikipedia.org/wiki/Printed_circuit_board

   Through-hole (leaded) resistors Through-hole devices mounted on the circuit board of a mid-1980s Commodore 64 home computer A box of drill bits used for making holes in printed circuit boards. While tungsten-carbide bits are very hard, they eventually wear out or break. Drilling is a considerable part of the cost of a through-hole printed ...

4. PCB (software) - Wikipedia

   en.wikipedia.org/wiki/PCB_(software)

   PCB is a free and open-source software suite for electronic design automation (EDA) - for printed circuit boards (PCB) layout. It uses GTK+ for its GUI widgets . History

5. Proteus Design Suite - Wikipedia

   en.wikipedia.org/wiki/Proteus_Design_Suite

   The Proteus Design Suite is a Windows application for schematic capture, simulation, and PCB (Printed Circuit Board) layout design.It can be purchased in many configurations, depending on the size of designs being produced and the requirements for microcontroller simulation.

6. Teardrop (electronics) - Wikipedia

   en.wikipedia.org/wiki/Teardrop_(electronics)

   For similar reasons, a technique called trace necking reduces (or necks down [7] [8] [9]) the width of a trace that approaches a narrower pad of a surface-mounted device or a through-hole with a diameter that is less than the width of the trace, or when the trace passes through bottlenecks (for example, between the pads of a component).

7. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   When making PCBs (printed circuit boards), manufacturers often test the solder paste deposits using SPI (solder paste inspection). SPI systems measure the volume of the solder pads before the components are applied and the solder melted. SPI systems can reduce the incidence of solder-related defects to statistically insignificant amounts.

8. Component placement - Wikipedia

   en.wikipedia.org/wiki/Component_placement

   Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...

9. Photolithography - Wikipedia

   en.wikipedia.org/wiki/Photolithography

   Photolithography is the most common method for the semiconductor fabrication of integrated circuits ("ICs" or "chips"), such as solid-state memories and microprocessors. It can create extremely small patterns, down to a few nanometers in size. It provides precise control of the shape and size of the objects it creates.